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Place of Origin: CHINA
اسم العلامة التجارية: ZMSH
إصدار الشهادات: rohs
Model Number: 3 Inch Quartz Wafer
شروط الدفع والشحن
Minimum Order Quantity: 10
الأسعار: by case
Packaging Details: Package in 100-grade cleaning room
Delivery Time: 5-8weeks
Payment Terms: T/T
Supply Ability: 1000pcs per month
Diameter: |
3 inch (76.2mm) |
Thickness Tolerance: |
±0.02mm |
Surface Roughness: |
≤1nm (Polished Grade) |
Transmittance @193nm: |
>92% |
CTE (RT-300°C): |
0.55×10⁻⁶/°C |
Applications: |
Semiconductor Manufacturing,High-power Lasers |
Diameter: |
3 inch (76.2mm) |
Thickness Tolerance: |
±0.02mm |
Surface Roughness: |
≤1nm (Polished Grade) |
Transmittance @193nm: |
>92% |
CTE (RT-300°C): |
0.55×10⁻⁶/°C |
Applications: |
Semiconductor Manufacturing,High-power Lasers |
ZMSH specializes in custom-manufactured 3-inch quartz wafers, offering tailored solutions for advanced optoelectronic, MEMS, and semiconductor applications. Unlike standard 2-inch wafers, 3-inch quartz wafers provide expanded surface area for multi-component integration, enabling high-precision devices with enhanced performance. Key features include:
· Material: High-purity fused silica (SiO₂) with <50 ppm hydroxyl content, ensuring ultra-low optical loss.
· Dimensions: Custom diameters (3.00" ±0.02") and thicknesses (0.525–1.200 mm, TTV ≤10 μm).
· Shapes: Circular, square, or irregular geometries with non-standard apertures, stepped edges, or gradient thickness.
· Surface Finish: Ultra-smooth surfaces (Ra ≤1.0 nm) for minimal light scattering.
| Parameter | Specification |
| Diameter | 3 inch (76.2mm) |
| Thickness Tolerance | ±0.02mm |
| Surface Roughness | ≤1nm (Polished Grade) |
| Transmittance @193nm | >92% |
| CTE (RT-300°C) | 0.55×10⁻⁶/°C |
| Parallelism | ≤5μm |
| Vacuum Compatibility | 10⁻⁹ Torr |
1. Optical Superiority
- Broad Spectral Transmission: >92% transmittance from 185 nm (UV) to 3500 nm (IR), ideal for UV lithography and quantum sensing .
- Low Thermal Expansion: CTE of 0.52×10⁻⁶/°C, maintaining dimensional stability up to 1100°C.
2. Mechanical & Chemical Resilience
- High Hardness: Mohs scale 7, resistant to abrasion and mechanical shock.
- Acid Resistance: 30× higher durability than ceramics, suitable for aggressive chemical environments .
3. Electrical Performance
- Insulation: Resistivity >10¹⁸ Ω·cm, minimizing parasitic capacitance in high-frequency circuits.
- SAW Compatibility: Optimized for Surface Acoustic Wave (SAW) filters with precise cutting angles (e.g., 34.33° for FC-cut) .
1. Advanced MEMS Devices
- Pressure sensors, gyroscopes, and inkjet printheads leveraging 3-inch wafers for multi-layer integration and thermal stability.
2. Optoelectronic Systems
- UV laser diodes, fiber-optic collimators, and LiDAR components requiring low-loss optical paths.
3. Semiconductor Packaging
- Wafer-level packaging (WLP) substrates for CMOS image sensors and RFICs, supporting TSV (Through-Silicon Via) technology.
4. Quantum Technologies
- Substrates for diamond nitrogen-vacancy (NV) centers and superconducting qubits, benefiting from ultra-low defect density.
ZMSH's quartz capillaries are engineered for microfluidic and optical applications, featuring:
- Custom Sizes: Inner diameters from 50 μm to 5 mm, lengths up to 300 mm.
- Ultra-High Purity: <1 ppm metallic impurities for biocompatibility in lab-on-a-chip systems.
- Processing: Laser drilling, thermal forming, and chemical etching for seamless integration into sensors or optical fibers.
1. Q: Why choose 3-inch quartz wafers?
A: 3-inch quartz wafers offer a balance between cost efficiency and performance, supporting multi-layer integration for MEMS sensors, optical filters, and semiconductor packaging with high-purity fused silica (OH⁻ <50 ppm) and ultra-low thermal expansion (CTE 0.52×10⁻⁶/°C).
2. Q: What are the key applications of 3-inch quartz wafers?
A: They are widely used in UV laser optics, fiber-optic components, MEMS gyroscopes, and advanced semiconductor packaging (e.g., TSV and WLP), leveraging their <1 nm surface roughness and >92% optical transmittance.
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